TSM
Taiwan Semiconductor (ADR)Chips & ComputeAI exposure: Significant
Manufactures nearly all leading-edge AI chips and does the advanced packaging (CoWoS) they need.
Alerts for TSM
01What does it supply?
Products, customers, and where it sits in the AI stack.
What the company does
Contract chip manufacturer (foundry) for chip designers worldwide.
Its role in AI
Makes the wafers for most AI accelerators and provides the advanced packaging that joins GPUs to high-bandwidth memory.
02How much does AI matter to its business?
Significant. A large and growing share of revenue or spending is AI-related.
Reported figures come from the company's own filings and releases. Estimates are third-party or editorial and are kept separate. The exposure label is an editorial judgment.
Reported by the company
- High Performance Computing platform was 66% of net revenue in 2Q26 (up from 61% in 1Q26); HPC revenue increased 20% sequentially.Source · 2Q26, quarter ended June 30, 2026
- Net revenue US$40.20 billion, up 33.7% year over year (NT$1,270.38 billion, up 36.0%); 2nm was 3%, 3nm 30% and 5nm 33% of wafer revenue.Source · 2Q26, quarter ended June 30, 2026
- Full-year 2026 capital budget raised to between US$60 billion and US$64 billion; 2Q26 capital expenditures totaled US$15.70 billion.Source · 2Q26 earnings call, July 16, 2026
Estimates
No third-party or editorial estimates are listed for TSM. Only company-reported figures are shown at present.
Key financial metrics, by reporting period
Company-reported, via TradingView03What should visitors watch next?
Earnings, product launches, customer spending, and the risks that matter.
Next earnings
No announced date on file. Check the investor relations page.
Watch list
- 3Q26 guidance: revenue US$44.6-45.8 billion, gross margin 65-67%, operating margin 56-58% source
- N2 ramp: management expects the steep 2nm ramp to dilute gross margin by about 3 to 4 percentage points in the second half of 2026 source
- Arizona: an additional US$100 billion investment announced for several more 2nm-and-below fabs; A14 risk production to start in 2027, volume in 2028 source
- September 2026 monthly sales due October 8, 2026 per TSMC's financial calendar source
Growth drivers
- Management says AI-related demand 'continues to be extremely robust' and conviction in the multi-year AI megatrend remains very high; 2026 revenue growth now expected slightly above 40% in US dollar terms source
- 3Q26 business expected to be supported by continued strong demand for leading-edge process technologies, including the steep ramp-up of 2-nanometer source
- The 20-F states that, driven by data explosion and AI application innovation, HPC has become the key growth driver for the business source
Risks
- Revenue is concentrated: the top ten customers accounted for 78% of 2025 net revenue and the largest customer 19%, so a change in demand from major AI/HPC customers could materially hurt results source
- US-China trade tensions and export controls on advanced semiconductors may require export licenses for certain shipments, potentially delaying deliveries and adversely affecting financial results source
- Global capacity expansion carries risks of construction delays, labor shortages, supply chain interruptions and utility constraints that could impair the ability to meet production timelines source
Recent developments: SEC filings
Source: SEC EDGAR · refreshed every 15 min- SC 13G/APassive >5% holder (amended)2024-02-05documentfolder
- SC 13GPassive >5% holder2023-02-17documentfolder
- SC 13G/APassive >5% holder (amended)2022-10-07documentfolder
- S-8Employee stock plan registration2022-06-17documentfolder
- SC 13GPassive >5% holder2022-02-07documentfolder
- SC 13GPassive >5% holder2022-02-04documentfolder
- SC 13G/APassive >5% holder (amended)2021-02-16documentfolder
- SC 13G/APassive >5% holder (amended)2020-09-09documentfolder
- SC 13G/APassive >5% holder (amended)2020-02-14documentfolder
- SC 13G/APassive >5% holder (amended)2020-02-06documentfolder
- SC 13G/APassive >5% holder (amended)2019-02-14documentfolder
- SC 13G/APassive >5% holder (amended)2019-02-07documentfolder
Insider trades
Form 4, last 6 filings| Insider | Transaction | Shares | Avg price | Filed |
|---|---|---|---|---|
Wu Yi-Huang VP | Open-market purchase · acquired | 40 | $76.20 | 2026-09-09 |
Yoo Chue-San VP | Open-market purchase · acquired | 53 | $76.20 | 2026-09-09 |
Yeap Choh Fei SVP | Open-market purchase · acquired | 54 | $76.20 | 2026-09-09 |
Yuan Lipen VP | Open-market purchase · acquired | 41 | $76.20 | 2026-09-09 |
Zhang Kevin Xiaoqiang SVP and Deputy Co-COO | Open-market purchase · acquired | 61 | $76.20 | 2026-09-09 |
Mii Yuh-Jier EVP and Co-COO | Open-market purchase · acquired | 71 | $76.20 | 2026-09-09 |
News
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Compare all →Original sources
- Investor relations — earnings dates, releases, presentations
- SEC EDGAR company page — every filing (CIK 0001046179)
- TradingView symbol page — full chart and data
Research note — ADR; reports in NT$ with US$ convenience figures (2Q26 rate 31.60). 3Q26 earnings conference date not yet listed on TSMC's financial calendar as of 2026-09-17. The 20-F excerpt fetched did not include the cover filing date; the 2026 capex range there (US$52-56B) predates the July 2026 raise to US$60-64B.